JPH0621253Y2 - 冷却フィン構造 - Google Patents

冷却フィン構造

Info

Publication number
JPH0621253Y2
JPH0621253Y2 JP5341388U JP5341388U JPH0621253Y2 JP H0621253 Y2 JPH0621253 Y2 JP H0621253Y2 JP 5341388 U JP5341388 U JP 5341388U JP 5341388 U JP5341388 U JP 5341388U JP H0621253 Y2 JPH0621253 Y2 JP H0621253Y2
Authority
JP
Japan
Prior art keywords
cooling fin
shaft portion
welding material
cooling
fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP5341388U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01156558U (en]
Inventor
健二 西浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5341388U priority Critical patent/JPH0621253Y2/ja
Publication of JPH01156558U publication Critical patent/JPH01156558U/ja
Application granted granted Critical
Publication of JPH0621253Y2 publication Critical patent/JPH0621253Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP5341388U 1988-04-20 1988-04-20 冷却フィン構造 Expired - Lifetime JPH0621253Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5341388U JPH0621253Y2 (ja) 1988-04-20 1988-04-20 冷却フィン構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5341388U JPH0621253Y2 (ja) 1988-04-20 1988-04-20 冷却フィン構造

Publications (2)

Publication Number Publication Date
JPH01156558U JPH01156558U (en]) 1989-10-27
JPH0621253Y2 true JPH0621253Y2 (ja) 1994-06-01

Family

ID=31279395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5341388U Expired - Lifetime JPH0621253Y2 (ja) 1988-04-20 1988-04-20 冷却フィン構造

Country Status (1)

Country Link
JP (1) JPH0621253Y2 (en])

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6231830B2 (ja) 2013-09-13 2017-11-15 住友ゴム工業株式会社 空気入りタイヤ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6231830B2 (ja) 2013-09-13 2017-11-15 住友ゴム工業株式会社 空気入りタイヤ

Also Published As

Publication number Publication date
JPH01156558U (en]) 1989-10-27

Similar Documents

Publication Publication Date Title
JP3241639B2 (ja) マルチチップモジュールの冷却構造およびその製造方法
US7439617B2 (en) Capillary underflow integral heat spreader
JP2005136018A (ja) 半導体装置
US20080153210A1 (en) Electronic assembly having an indium wetting layer on a thermally conductive body
CN110622627B (zh) 半导体装置
JP2005244166A (ja) 半導体装置
CN104576565A (zh) 具有散热体的半导体器件及其组装方法
JPH0982844A (ja) 半導体モジュール基板及びその製造方法
WO2012093509A1 (ja) 半導体装置およびその製造方法
JPH0621253Y2 (ja) 冷却フィン構造
JP2001135758A (ja) パワーモジュールの放熱構造
JPS60137042A (ja) 樹脂封止形半導体装置
JPH09102567A (ja) 半導体装置
JP2003318579A (ja) 放熱板付きｆｅｔの放熱方法
JP2000174195A (ja) パワーモジュール
JP2003046211A (ja) 電子部品の実装構造
JP7561969B2 (ja) 半導体装置および半導体装置の製造方法
JPS63228650A (ja) 発熱素子用冷却装置
JP4513236B2 (ja) 異種金属接合品の接合方法
JPH08116003A (ja) フィンの製造方法
JP7392632B2 (ja) 半導体装置、ダイパッドおよび半導体装置の製造方法
JPH05160306A (ja) 放熱構造
JP2003023129A (ja) パワー半導体装置および素子実装用放熱板の製造方法
WO2004105129A1 (ja) プリント基板ユニットおよびその製造方法
JP3732604B2 (ja) 樹脂パッケージ型半導体装置、およびその製造方法